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    Please use this identifier to cite or link to this item: http://ccur.lib.ccu.edu.tw/handle/A095B0000Q/226

    Title: 結合有限元素法與簡化分析模型應用於微電子元件設計;Coupled Finite Element Method and Simplified Method Applied to Micro-electronic Components Design
    Authors: 呂杰融;LU, CHIEH-JUNG
    Contributors: 機械工程系研究所
    Keywords: 內引腳接合;有限元素法;電磁固耦合;簡化模型;Inner Lead Bonding (ILB);Finite Element Analysis (FEA);Coupled electromagnetic-structural;Simplify structure method
    Date: 2017
    Issue Date: 2019-07-17
    Publisher: 機械工程系研究所
    Abstract: 良好的內引腳接合技術在先進製程中扮演重要的角色。本論文在實驗部分提出一非接觸式溫度量測方法,成功取得內引腳壓合時的環境溫度與接合處溫度相關資料;在有限元素模擬方面,也提出一內引腳壓合簡化模型分析方法,藉由實驗取得的溫度資料,先行分析內引腳壓合時的整體溫度分佈,再配合不同溫度分佈區間,輸入對應該溫度區間的材料參數,便可重現出內引腳壓合時真實應力分佈狀況。本分析方法不但準確度高,同時亦減少分析所需的時間及複雜度,對於縮短產線研發時間有著顯著的幫助。另一方面,本論文針對手機相機模組中的彈片提出利用逆向工程的方式建立其有限元素模型。同時針對彈片的運作方式提出兩種數值模型分析方式,簡化結構分析法與電磁固耦合法。首先針對彈片幾何計算出合適剛性並在設計上對應磁路模組所需彈片尺寸,以避免運作過程中產生應力集中現象,且能符合所使用材料的安全係數不產生永久變型。其次利用參數分析提升該彈片的效能,達到使用較少電流即可輕易推動完成對焦的省電性,同時不失去對焦精準度,符合各相機模組出廠前的規範。本論文更進一步利用所提出的改良型有限元素模型進行電子封裝製程及彈片參數設計研究,如此不但能縮短分析時間,同時還能保有相當程度之準確度,相信可為產線研發人員提供一新式的研發手法及思路。
    One of the key factors to design a reliable eutectic Au-Sn solder joints used in flip-chip-on-film (FCOF) packaging is the bonding temperature distribution at the interface of gold bump and copper lead on the inner lead bonding (ILB) process. Accordingly, this study proposes a method based on a non-contact Infrared (IR) spot sensor for determining the inner lead (IL) interface temperature. The experimental results are used to construct an ANSYS simplify finite element (FE) model of the FCOF system to simulate temperature-dependent ILB process. A good agreement is observed between the numerical and experimental results for the deformed profile of the polyimide film /copper lead following the bonding process and the variation of the bump sinking value with the bonding force. Finally, the numerical results are used to construct a FCOF/ILB parameter design chart for selecting the bonding force required to obtain a given gap size and bump sinking value in the FCOF/ILB process.On the other hand, the metal springs in the Auto-Focus (AF) module should combine high stiffness with a good actuation response and a light weight. The present study utilizes a reverse engineering approach to construct three-dimensional finite element models of the top and bottom springs in the VCM mechanism. In performing the simulations, the actuation force is computed using two different analysis methods, namely a simplify structure method and a coupled electromagnetic-structural method. It is shown that the simplify structure method has the advantages of a lower computational complexity and a more comprehensive modeling capability. A further series of simulations is thus to examine the effects of the spring shape parameters on the reaction force developed by the spring stiffness. The simulation results obtained for different spring shape parameter settings are summarized in the form of a parameter design chart for predicting the reaction force given known values of the spring rib length and spring thickness.
    Appears in Collections:[機械工程學系] 學位論文

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