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    Please use this identifier to cite or link to this item: http://ccur.lib.ccu.edu.tw/handle/A095B0000Q/142


    Title: 優化直接壓印與嵌入式壓印及金屬蝕刻製程製備Au/PMMA複合光柵之研究;Fabrication of Au/PMMA Composite Gratings through Optimization of the Direct Imprint and Insertion Imprint Processes and RIE Etching Process
    Authors: 邱育慈;CHIU, YU-TZU
    Contributors: 機械工程系研究所
    Keywords: 直接金屬奈米壓印;嵌入式奈米壓印;金光柵;偏振片;PMMA基板;乾式蝕刻;RIE;ICP-RIE;Direct metal nanoimprint;Insertion nanoimprint;Gold gratings;Polarizers;PMMA substrate;Dry etching;RIE;ICP-RIE
    Date: 2018
    Issue Date: 2019-05-23 12:52:42 (UTC+8)
    Publisher: 機械工程系研究所
    Abstract: 本研究突破了傳統光學微影方法的繁複步驟與高昂的曝光機設備,以直接金屬奈米壓印(Direct Metal Nanoimprint)一步到位使金屬光柵成型,結合嵌入式奈米壓印(Insertion Nanoimprint)技術使金光柵圖案嵌入至PMMA軟性透明基板中,最後搭配乾式蝕刻製程去除金屬殘留層(Residual Layer),即製得可應用於液晶螢幕背光模組中具偏振功能的導光板。 由於直接金屬奈米壓印存在成型性不均的問題,圖案邊緣成型性較好,而圖案中央的成型性較差,因此本研究於壓印前針對金薄膜採取退火軟化熱處理並提升壓印機台的製程溫度極限,以改善金屬材料在壓印階段的流動性,並可達到最小線寬70 nm之金光柵成型。於嵌入式壓印製程討論抗沾黏層的選用,本研究提出以FDTS作為抗沾黏層,可使嵌入式翻印時金薄膜之脫模有最佳效果。 最後再以乾式蝕刻技術去除金屬殘留層,本研究嘗試了反應式離子蝕刻(Reactive Ion Etching, RIE)與感應耦合電漿體反應式離子蝕刻(Inductively Coupled Plasma RIE, ICP-RIE),同時比較氟系與氯系兩種蝕刻氣體,得到蝕刻後表面品質最佳且蝕刻製程時間最短的乾式蝕刻製程參數,製得可對可見光有偏振效果之線寬210 nm之Au/PMMA複合光柵偏振片。
    In this study, gold/PMMA comosite gratings of nano-scale were fabricated by combining Direct Metal Nanoimprint process and Insertion Nanoimprint process. Instead of using conventional photolithographic method, gold gratings were formed on Si-substrate under moderate temperature and elevated pressure using a direct metal nanoimprint process, then the gratings were inserted into a flexible and transparent PMMA substrate with subsequent dry etching to remove the gold residual layer to fulfill the light-passing characteristic of gratings. Due to non-uniform formability during direct metal nanoimprint, grating formation on the edge of the gold thin film is much better than that in central area. A subsequent annealing treatment to soften the gold thin film was proposed to improve the flow behavior of gold film under imprint pressure. The effect of annealing treatment was discussed. Choosing appropriate anti-stiction layer receipe is important for lift-off of gold film from Si-substrate during insertion imprint process. FDTS exhibited superior porperties among different receipes on hydrophobicity and on ease of lift-off process. RIE (Reactive Ion Etching) and ICP-RIE (Inductively Coupled Plasma RIE) were applied to remove the gold residual layer. Etching atmosphere containing chloride revealed better etching effect and shorter process time than fluoride atmosphere.
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