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    Please use this identifier to cite or link to this item: http://ccur.lib.ccu.edu.tw/handle/A095B0000Q/118

    Title: 植晶過程中細長型晶元強度測試與膠材特性參數開發;Strength Test of Slender Die and Development of Glue Characteristic Parameters in Die Pick Up Process
    Authors: 池俊穎;CHIH, JYUN-YING
    Contributors: 機械工程系研究所
    Keywords: 晶粒軟板式封裝;植晶頂針製程;四點彎矩實驗;膠合元素;高速攝影;Chip On Film Packaging;Die Bond;Four Point Bending;Cohesive Element;High Speed camera
    Date: 2018
    Issue Date: 2019-05-23 12:52:36 (UTC+8)
    Publisher: 機械工程系研究所
    Abstract: 平面顯示器技術不斷進步,元件尺度設計邁向輕薄短小已經變成一種趨勢。常用之驅動 IC;晶粒軟板式封裝(Chip On Film Packaging, COF);的製程技術也朝高功能、高功率以及高 I/O 數邁進。COF 因受限於擺放空間需設計成高細長比晶片,與傳統晶片相比,更易在植晶頂針過程中造成晶粒斷裂損傷。因此探討細長型晶元的強度與植晶過程的參數是改善植晶損傷的重要研發方向。 本研究使用四點彎矩實驗(Four Point Bending, 4PB),以測試出晶粒斷裂力的極限值且利用高速攝影技術拍攝實驗瞬間,並得知較厚的晶圓在實驗中並不會產生滑移之現象。在數值分析方面,建立 4PB 有限元素分析模型,模擬實驗過程進而得到細長型晶元之破裂應力。膠材測試部分,利用微拉力試驗機建立正向拉伸測試(Normal Test)和剪向拉伸測驗(Shear Test),得到之後模擬所需之膠合元素參數範圍,最後使用田口法在範圍中選取參數數值,再搭配植晶實驗和高速攝影及模擬,逆尋膠合元素之材料參數。
    According to the enhancement of LCD technique, the requirements of lighter, thinner, shorter, and smaller products have become a trend for the LCD industry. The typical driver IC, Chip On Film Packaging (COF), has to improve the design to meet the target of high performance with high I/O count. Compared with the traditional package, the die in COF needs to be designed as a slender shape with high slenderness ratio. It can be easily caused damage by the adhesive force between bonding UV type and die during die pick up process. Therefore, to investigate breaking strength of high slenderness ratio die, and analyze the die bond pick up parameters are very important research topics. In this research, we use Four Point Bending (4PB) test to measure the limited breaking force of slender shape die and use the technology of high speed camera to capture whole experimental process clearly, and satisfy the thickness die will not slip during the 4PB test. Moreover, finite element simulation model about 4PB was developed to obtain the breaking stresses for slender shape die as the design limit for pick up process. About adhesive test, the normal test and shear test will be setup to find the cohesive element parameter range, at last, use Tauguchi method to choose the value from the parameter range, use the die pick up experiment with high speed camera and simulation to find the correct cohesive parameter.
    Appears in Collections:[機械工程學系] 學位論文

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