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    Please use this identifier to cite or link to this item: http://ccur.lib.ccu.edu.tw/handle/A095B0000Q/117


    Title: 應用有限元素分析探討銀銲線迴路形狀之研究;Study on Shape of Silver Wire Bonding Loop by Finite Element Analysis
    Authors: 廖則瑋;LIAO, TSE-WEI
    Contributors: 機械工程系研究所
    Keywords: 銲線迴路成形;微拉伸實驗;有限元素法;參數最佳化;wire loop forming profile;micro-tensile test;finite element method;parameter optimization
    Date: 2018
    Issue Date: 2019-05-23 12:52:36 (UTC+8)
    Publisher: 機械工程系研究所
    Abstract: 本研究主要目的是以新銲線材料(銀合金線)建立銀銲線有限元素模型,並探討銲線迴路路徑對新材料之成形影響。實驗方面,?用MTS Tytron 250微?試驗機搭配環境加溫?,進?銀合金線(Silver alloy wire)材料微?伸實驗及熱影響區拉伸實驗,以取得銀合金線在?同溫?區間及熱影響區之熱-機械材?之應?-應變曲線(Stress-Strain Curve),亦進行銀銲線路徑成形實驗,以驗證有限元素模型;?值模擬方面,透過建立銀銲線接合之有限元素(FEM,Finite Element Method)模型,考慮晶片導熱傳至線材上之溫?分布並結合拉伸實驗所得之材料應?-應變曲線,以分析銀線在線路成形過程中產生的應力分佈情形,且模擬成形結果與銀銲線路徑成形實驗進行比較。再者?解銀線接合下,製程迴路??對銲線成形形狀與應力分佈的影響。最後,本研究更進一步根據業界實務經驗,所歸納出封膠製程模流所造成之應力,以此定出目標應力,進行路徑迴路(反向運動)之參數最佳化,繪製出參數最佳化等高線圖。此研究成果可輔助工程設計者進行銲線成形軌跡分析與銲線機使用者可依需求快速查找設定出所需要之製程迴路參數。
    The main purpose of this research is to establish a finite element model of silver wire with new wire material (silver alloy wire) and to explore the effect of the new materials wire looping profile. In the study, use the MTS Tytron 250 micro force tensile test machine and the environmental heating chamber were used to do the silver alloy wire material micro-tensile test and the heat-affected zone tensile test, getting the silver alloy wire stress-strain curve at different temperature ranges and heat-affected zone. Do silver alloy wire forming profile experiment to verify finite element model. In the simulation, through the establishment of Finite Element Method (FEM) model of silver alloy wire bonding, considering the temperature distribution of the heat conduction from the wafer to the wire and combining the stress-strain curve of the material obtained by the tensile test, analyze the stress distribution of the silver wire during the forming profile, and compare the results of the simulation with the silver alloy wire forming profile experiment. Furthermore, realize the effect of the process parameters on the forming shape and stress distribution of the silver alloy wire.Finally, this research set the target stress based on the stress caused by the mold flow in the subsequent packaging process of the industry information, optimize the parameters of the path loop (reverse motion), and plot the contour map of the optimized parameters. The results of this research can assist the engineering designer in the analysis of the formation loop path of the wire and the wire bonder operator can quickly find and set the required process loop parameters according to the their needs.
    Appears in Collections:[機械工程學系] 學位論文

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